In response to the global push for miniaturization and integration, Infineon Technologies AG has launched the 4.5 kV XHP™ 3 IGBT module series, which will fundamentally change the medium voltage drives (MVD) operating from 2000 to 3300 VAC and the transportation landscape. applications. Layer 2 and Layer 3 topologies.
Applications that can take advantage of IGBT modules include large conveyors, pumps, high-speed trains, locomotives, and commercial, construction and agricultural vehicles (CAVs).
The XHP Series includes 450 A dual IGBT modules with TRENCHSTOP™ IGBT4 and emitter driven diodes, as well as 450 A dual diode modules with E4 emitter driven diodes. Both modules have improved insulation characteristics up to 10.4 kV. Together, they help simplify parallelization and reduce scale without sacrificing efficiency. Previously, parallel switching of modules required complex buses, which resulted in design complexity and increased leakage inductance. The innovative design of the XHP Series simplifies parallel connections by conveniently placing connections side by side. Therefore, only one direct bus is required for a parallel connection.
The 4.5 kV XHP series also allows designers to reduce the number of devices. The traditional IGBT approach uses multiple single switches and a dual diode. However, with the new family of IGBT devices, the design can be reduced to two double switches and a smaller double diode, an important step forward in achieving integrated control.
The combination of the XHP 3 FF450R45T3E4_B5 dual switch and the DD450S45T3E4_B5 dual diode provides significant cost savings and reduced footprint. For example, Infineon’s previous IGBT solution required four 140 x 190 mm or 140 x 130 mm switches and a 140 x 130 mm dual diode. The new XHP series reduces the number of components to two 140 x 100mm double switches and a smaller 140 x 100mm double diode.
Post time: Jun-06-2024