Kariya City, Kuwana, Japan / Hsinchu, Taiwan – May 10, 2023 – Denso Corporation (DENSO), a leading provider of mobile devices, and UMC Japan Co., Ltd. (“USJC”), a wholly owned subsidiary of global semiconductor manufacturer UMC Corporation (NYSE: UMC; TW: 2303) (“UMC”) today announced that it is jointly manufacturing insulated gate bipolar transistors* (IGBTs) and has begun mass production of 300- millimeter plant USJC. Today was the first shipping ceremony dedicated to this important milestone. Just a year ago, the two companies announced a strategic partnership for this critical power semiconductor used in electric vehicles.
As EV adoption accelerates, automakers are looking to improve powertrain efficiency while making EVs more fuel efficient. The production line jointly invested by USJC supports the production of a new generation IGBT developed by DENSO that reduces power loss by 20% compared to previous generation equipment. Production is expected to reach 10,000 plates per month by 2025. The ceremony took place today at the USJC plant in Mie Prefecture, Japan. The event was attended by DENSO President Koji Arima, UMC Co-President Jason Wang, Director of the Business Information Policy Bureau of the Ministry of Economy, Trade and Industry Satoshi Nohara, Mie Prefecture Governor Katsuyuki Ichimi, and Kuwana City Mayor Ming Takashi Ito. “Today, we are pleased to celebrate an unforgettable shipping ceremony that symbolizes the partnership between DENSO, UMC and USJC. We come from different cultures such as the semiconductor industry and the automotive industry. However, we are the source of our strong competitiveness. DENSO President Koji Arima said: “Together with our trusted partners, DENSO will continue to accelerate electrification by producing competitive semiconductors to protect the global environment and create a society full of smiles. standard production on 200mm wafers Thanks to our professional team and the support of DENSO, we were able to successfully complete trial production Michiari Cavanaugh, President of USJC and Reliability Testing said, “I am honored to be a strategic partner for DENSO, a leading provider of automotive solutions to global automakers. This collaboration fully demonstrates the manufacturing capabilities and our strength of UMC. “UMC Co-President Jason Wang said, “A collaborative approach to ensure the success of our foundry customers. “Vehicle electrification and automation will continue to drive the increase in semiconductor content, especially chips made using specialized foundry processes at the 28nm node and above. As a leader in specialized technology, UMC is well positioned to play a larger role in the automotive value chain, enabling our partners to seize opportunities and gain market share in this rapidly growing industry. “
Left to right: USJC Chairman C.F. Zou, UMC Co-President Jason Wang, Mie Prefectural Governor Ichimi Katsuyuki and Nohara Satoshi, Kuwana Denso President Arima Koji and Denso Senior Executive Yoshifumi Kato.
* Insulated Gate Bipolar Transistor (IGBT) is the main device that acts as a switch in the inverter and converts the DC battery current into AC current to drive and control the motor of an electric vehicle. Battery and plug-in electric vehicles require more IGBT units than conventional combustion engine vehicles.
ABOUT DENSO Headquartered in Kariya, Japan, DENSO is a leading $47.9 billion mobile device supplier developing advanced technologies and components for virtually every make and model of vehicle on the road today. Building on manufacturing, DENSO has invested in approximately 200 factories around the world, providing high-paying career opportunities and manufacturing advanced electrification technologies, powertrains, thermal and mobile electronics and more, changing the way the world lives. By developing these solutions, the company’s 165,000 employees around the world are paving the way for a mobile future that improves lives, eliminates traffic accidents and protects the environment. For the fiscal year ended March 31, 2023, DENSO spent approximately 9.0% of its global consolidated sales on research and development. For more information on DENSO’s global activities, visit https://www.denso.com/global. About UMC UMC (NYSE): United Microelectronics, Taiwan Stock Exchange: 2303) is the world’s leading semiconductor manufacturing company. The company provides high quality IC manufacturing services with a focus on logic and a variety of specialized technologies, serving all major areas of the electronics industry. UMC’s integrated circuit processing technology and manufacturing solutions include logic/mixed signal, embedded high voltage, embedded non-volatile memory, RFSOI and BCD, etc. Much of UMC’s core R&D in 12″ and 8″ plants is located Taiwan and other Asian countries. UMC has a total of 12 manufacturing plants with a total capacity of about 850,000 plates (equivalent to 8 inches) per month, and all of them have passed the IATF 16949 automotive quality standard certification. Headquartered in Hsinchu, Taiwan, UMC has offices in the US, Europe , China, Japan, Korea and Singapore, and employs 20,000 people worldwide. For more information visit: https://www.umc.com. UMC Statement Regarding Forward-Looking Statements Certain statements in the above announcement are forward-looking statements within the meaning of US federal securities laws, including statements regarding: introduction of new services and technologies, future outsourcing, competition, plate capacity, business relationships. and market conditions. Investors are cautioned that actual events and results could differ materially from these statements due to a variety of factors, including the overall semiconductor market and economic conditions, acceptance and demand for UMC products, and technology and development risks. Additional information about these and other risks is contained in UMC filings with the Securities and Exchange Commission. UMC undertakes no obligation to update any forward-looking statements as a result of new information, future events or otherwise, except as required by applicable law.
Post time: Aug-24-2023